About Us

DSEOINC advanced semiconductor packaging creates the best solution for high heat dissipation. Our core technologies based on electronic ceramics such as aluminum nitride (AlN), silicon nitride (SiN), and alumina (Al2O3) successfully developed vacuum diffusion welding and eutectic bonding on packaged components with high-reliability requirements.

We provide an integrated turnkey service that offers a complete solution for resolving ceramic circuit board, lead frame, eutectic attach, and vacuum packaging custom design and entire processing.

DSEOINC advanced semiconductor packaging creates the best solution for high heat dissipation. Our core technology based on electronic ceramics such as aluminum nitride (AlN), silicon nitride (SiN), and alumina (Al2O3) successfully developed vacuum diffusion welding and eutectic bonding on packaged components with high-reliability requirements. We provide an integrated turnkey service that offers a complete solution for resolving ceramic circuit board, lead frame, eutectic attach, and vacuum packaging custom design and entire processing.

DSEOINC delivers high-quality and high-power UVC components to microbial contamination control applications and other related industries, built on our core technologies and supply chain integration. We are also leading the market to launch UVC applications for consumers.

Core Technologies

• Ceramic Substrate, Circuit board Grinding and Polishing Technology
• Ceramic Substrate Metallization and Brazing Technology
• Full-Inorganic Materials, Brazing and Vacuum Packaging Processing technology